Leadership in RF Testing
Primary test platforms available at STATS ChipPAC for RF Test Click here to request the availability of other RF test platforms at STATS ChipPAC.
Since its inception in 1995 as a single factory in Singapore, STATS ChipPAC focused on RF test solutions and established itself as a leader in RF testing. Since then, STATS ChipPAC has extended its leadership in RF Test into all of STATS ChipPAC’s factories worldwide.
Currently, over 30% of all the devices tested at STATS ChipPAC are RF devices that cover the entire spectrum of RF devices--from simple RF transceivers to the most complex RF networking or mobile phone devices.
Having already successfully tested most of the RF devices that are currently available in the wireless market, STATS ChipPAC is capable of testing the full spectrum of RF devices highlighted in the figure below.
Every test subcontractor can do some RF testing, but STATS ChipPAC consistently does it all with proven RF test solutions that have been optimized over its long history of RF Test.
High Throughput
Multi-site testing of RF devices presents unique challenges due to the RF interference between test sites. STATS ChipPAC’s
Test Development Center can multiply the throughput for its RF customers by migrating their current RF test setups from single site to dual site or quad site with built-in RF shielding and isolation to avoid losses in first pass yields from RF interference between sites.
The Test Development Center also offers test time reduction services for optimizing existing RF tests to improve throughput.
RF Test Development Services
With its leadership in RF testing, STATS ChipPAC’s Test Development Center offers many other development services for RF Test.
Click here to learn more about these services.
One Look, One Experience
STATS ChipPAC’s best practices in RF test, developed since STATS ChipPAC was founded in 1995, have been implemented in all of STATS ChipPAC worldwide factories, thus eliminating all potential sources of RF interference and signal degradation from its test floors.
For example,
- Mobile phones and other sources of outside RF interference are not allowed on any STATS ChipPAC test floor where RF testing is performed.
- When RF load boards are offloaded into STATS ChipPAC, they are inspected for weaknesses in the RF signal path, which are corrected on-site before they are released into production.
- STATS ChipPAC employs best-in-class RF calibration techniques and maintenance practices that move and maintain the RF calibration plane as close to the device pins as physically possible.
Also embedded within its RF Test setups are R&D driven, proprietary RF test solutions at both Wafer Test and Final Test designed to maximize and stabilize first pass and final yields at each RF Test stage. From its early years testing RF devices, STATS ChipPAC knows that unpleasant production surprises happen most often when testing RF devices. STATS ChipPAC’s proven test solutions and techniques developed over its long history of RF testing enables its customers to avoid these unpleasant RF-related surprises in production.
Full Turnkey Solutions
When doing business with STATS ChipPAC, the greatest value comes from full turnkey solutions.
Click here to learn more.
Testing Highly Integrated RF Products
When package size and cost matter, STATS ChipPAC offers its customers the lowest cost method to easily integrate an RF component with any digital or baseband component to create an RF system in a package with extremely small dimensions.
STATS ChipPAC can accomplish this by blending its leadership in IPD (Integrated Passive Devices and components etched onto silicon) and other Wafer Level products. This is exemplified by the Wireless LAN system in a package illustration shown here.
Similar integration of an RF module with base band and digital modules into a single package can be achieved using a STATS ChipPAC stacked die solution.
These advanced RF system packages require multiple test stages at both Wafer Level and Final Test. From its leadership in advanced packages, STATS ChipPAC has developed a complementary leadership in the testing of these advanced packages with
Known Good Die test strategies that enable our customers to minimize both test costs and test losses when testing these advanced RF packages and devices.