Company Information
A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides fully integrated packaging and testing solutions that bring products to the market faster. STATS ChipPAC’s full turnkey semiconductor solutions include package design, bump, probe, assembly, test and distribution services. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
With a strong technology portfolio ranging from leadframe to laminate, flip chip, wafer level and advanced 3D packages, STATS ChipPAC provides customers with innovative and cost-effective semiconductor solutions. We have a leadership position in advanced packaging technology including fan-in and fan-out wafer level packaging, flip chip interconnect, 3D integration and Through Silicon Via (TSV) to meet the increasing market demand for next-generation devices with higher levels of integration, increased functionality and compact sizes. We provide wafer probe and final testing on a diverse selection of test platforms, with expertise in testing a broad range of semiconductors for mixed-signal, RF, analog and high-performance digital devices. We focus on developing new technologies and optimizing the test process through multi-site testing, strip testing, test program optimization and hardware improvements designed to improve test efficiencies and yield while reducing test times.
We work closely with customers to deliver the best possible solution in terms of technology innovation, performance, quality, cycle time and cost.
With corporate headquarters in Singapore, our manufacturing facilities are strategically located in South Korea, Singapore, China, Malaysia, Thailand and Taiwan (which includes our 52%-owned subsidiary, STATS ChipPAC Taiwan Semiconductor Corporation). We market our services through our direct sales force in the United States, South Korea, Japan, China, Singapore, Malaysia, Taiwan and Switzerland. With an established presence in the countries where strategic semiconductor markets are located, we are in close proximity to the major hubs of wafer fabrication which allows us to provide customers with fully-integrated, multi-site, end-to-end packaging and test services.
STATS ChipPAC is listed on the Singapore Exchange Securities Trading Limited (SGX-ST).